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Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
Published on: June 23, 2018
A 45 nm Stacked CMOS Image Sensor Process Technology for Submicron Pixel
Seiji Takahashi1, Yi-Min Huang2, Jhy-Jyi Sze3
1Taiwan Semiconductor Manufacturing Company, No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300, Taiwan. seijit@tsmc.com.
Abstract:
A submicron pixel's light and dark performance were studied by experiment and simulation. An advanced node technology incorporated with a stacked CMOS image sensor (CIS) is promising in that it may enhance performance. In this work, we demonstrated a low dark current of 3.2 e-/s at 60 °C, an ultra-low read noise of 0.90 e-·rms, a high full well capacity (FWC) of 4100 e-, and blooming of 0.5% in 0.9 μm pixels with a pixel supply voltage of 2.8 V. In addition, the simulation study result of 0.8 μm pixels is discussed.

