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Updated: Feb 16, 2026
Application of Light-cured Dental Adhesive Resin for Mounting Electrodes or Microdialysis Probes in Chronic Experiments
Published on: July 30, 2007
Comparison of the Dentin Bond Strength of Two Self-Etch Adhesives After Prolonged Air-Drying and Additional
Pouran Samimi1, Masoud Ghodrati2, Farinaz Shirban3
1Associate Professor, Dental Materials Research Center, Department of Operative Dentistry, School of Dentistry, Isfahan University of Medical Sciences, Isfahan, Iran.
Objectives:
It has been reported that the water, solvents, or the primer incorporated into adhesive resins decrease the polymerization, compromise the mechanical properties, reduce the bond strength, and lead to a poor bonding performance of self-etch adhesives. This article evaluated the effect of air-drying and light-curing duration of self-etch adhesives on the micro-shear bond strength between composite resin and dentin.
Materials And Methods:
A total of 120 extracted sound human third molars were randomly divided into twelve groups (n=10). The occlusal dentin in each tooth was exposed. Clearfil SE Bond (CSEB) and Clearfil S3 Bond (CS3B) were used according to the manufacturer's instructions, followed by air-drying for 3 and 10 seconds in different groups. The adhesives were light-cured for 10, 20 and 40 seconds in different subgroups. Next, the composite resin (Clearfil AP-X) was placed on the dentin surface and was polymerized for 40 seconds. The micro-shear bond strength values were determined using a universal testing machine, and the results were statistically analyzed by three-way ANOVA and Tukey's post-hoc test (α=0.05).
Results:
CSEB exhibited a significantly higher dentin bond strength than CS3B. Increasing the curing time of CSEB resulted in an increase in the bond strength, whereas an increase in the air-drying time did not affect the bond strength of the two adhesives.
Conclusions:
Within the limitations of this study, an increase in the curing time improved the bond strength of CSEB, whereas the air-drying time did not affect the bond strength of the evaluated adhesives.
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