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3D printed high density, reversible, chip-to-chip microfluidic interconnects.

Hua Gong1, Adam T Woolley, Gregory P Nordin

  • 1Department of Electrical and Computer Engineering, Brigham Young University, Provo, UT 84602, USA. nordin@byu.edu.

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|January 23, 2018
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Summary
This summary is machine-generated.

New 3D printed microgaskets enable highly integrated microfluidic chips by providing reliable chip-to-chip connections. These simple integrated microgaskets (SIMs) and controlled-compression integrated microgaskets (CCIMs) are reusable and withstand high pressures for advanced microfluidic applications.

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Area of Science:

  • Microfluidics and Lab-on-a-Chip Technology
  • Additive Manufacturing / 3D Printing
  • Materials Science and Engineering

Background:

  • Miniaturization of 3D printed microfluidic chips to a few mm requires robust world-to-chip interconnection methods for reagents and pneumatics.
  • Existing interconnection methods may require additional materials or complex fabrication steps, hindering integration.

Purpose of the Study:

  • To introduce and validate novel 3D printed microgasket designs (SIMs and CCIMs) for seamless chip-to-chip interconnections.
  • To demonstrate the high density, reliability, and reusability of these integrated microgaskets for microfluidic systems.
  • To showcase the utility of CCIMs for testing arrays of micro-scale devices, such as 3D printed valves.

Main Methods:

  • Development and direct 3D printing of Simple Integrated Microgaskets (SIMs) and Controlled-Compression Integrated Microgaskets (CCIMs) as part of microfluidic device chips.
  • Fabrication of 11x11 arrays of SIMs and CCIMs, evaluating interconnection density, pressure resistance (up to 50 psi), and reusability over 100 cycles.
  • Demonstration of CCIMs for testing 3D printed valves (300 μm diameter) in a 9x5 array, assessing performance over millions of actuations.

Main Results:

  • Achieved 121 chip-to-chip interconnections per chip with SIMs and CCIMs at an areal density of 53 interconnections/mm².
  • Demonstrated high reliability, withstanding 50 psi fluid pressures and 100 reuse cycles without seal failure.
  • Successfully tested 45 micro-valves using CCIM interconnections, withstanding up to 1,000,000 actuations without failure.

Conclusions:

  • SIMs and CCIMs offer a simple, integrated, and material-efficient solution for connecting miniaturized 3D printed microfluidic chips.
  • The high density and robust performance of CCIMs enable scalable testing and operation of complex microfluidic systems and components.
  • These microgasket technologies facilitate the development of highly integrated and functional microfluidic devices for diverse applications.