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Updated: Feb 15, 2026

Analysis of Contact Interfaces for Single GaN Nanowire Devices
Published on: November 15, 2013
Ultrathin silicon oxynitride layer on GaN for dangling-bond-free GaN/insulator interface
Kengo Nishio1, Tomoe Yayama2, Takehide Miyazaki2
1National Institute of Advanced Industrial Science and Technology (AIST), Central 2, Umezono 1-1-1, Tsukuba, Ibaraki, 305-8568, Japan. k-nishio@aist.go.jp.
Abstract:
Despite the scientific and technological importance of removing interface dangling bonds, even an ideal model of a dangling-bond-free interface between GaN and an insulator has not been known. The formation of an atomically thin ordered buffer layer between crystalline GaN and amorphous SiO2 would be a key to synthesize a dangling-bond-free GaN/SiO2 interface. Here, we predict that a silicon oxynitride (Si4O5N3) layer can epitaxially grow on a GaN(0001) surface without creating dangling bonds at the interface. Our ab initio calculations show that the GaN/Si4O5N3 structure is more stable than silicon-oxide-terminated GaN(0001) surfaces. The electronic properties of the GaN/Si4O5N3 structure can be tuned by modifying the chemical components near the interface. We also propose a possible approach to experimentally synthesize the GaN/Si4O5N3 structure.
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