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Published on: July 15, 2019
Titanium contacts to graphene: process-induced variability in electronic and thermal transport
Keren M Freedy1, Ashutosh Giri2, Brian M Foley2
1Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA 22904, United States of America.
Titanium contact composition, tunable via deposition conditions, linearly correlates with Ti/graphene contact resistance. Interface oxide composition also impacts thermal boundary conductance in graphene devices.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Contact resistance (RC) significantly limits graphene device performance.
- RC is influenced by interface quality and contact material composition, which are affected by fabrication processes like graphene transfer and contact deposition.
- Understanding and controlling these factors are crucial for advancing graphene electronics.
Purpose of the Study:
- To investigate the relationship between titanium (Ti) contact composition and Ti/graphene contact resistance.
- To explore the tunability of contact composition through deposition parameters.
- To analyze the effect of contact deposition conditions on thermal transport properties at the interface.
Main Methods:
- X-ray photoelectron spectroscopy (XPS) for characterizing Ti contact composition.
- Transfer length method (TLM) for measuring Ti/graphene contact resistance.
- Time-domain thermoreflectance (TDR) for evaluating thermal transport.
Main Results:
- A linear correlation was observed between Ti contact composition and measured contact resistance.
- Contact composition was successfully tuned by altering deposition rate and base pressure.
- Reactor base pressure was identified as a key factor influencing contact resistance.
- Interfaces with higher oxide composition exhibited lower thermal boundary conductance.
Conclusions:
- Contact resistance in Ti/graphene systems is directly tunable by controlling contact composition through deposition parameters.
- Base pressure during deposition is a critical factor for managing contact resistance.
- Interface oxide composition plays a role in modulating thermal boundary conductance, suggesting potential for thermal management applications.
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