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Thickness measurement by two-sided step-heating thermal imaging
Xiaoli Li1, Ning Tao1, J G Sun2
1Beijing Key Lab for Terahertz Spectroscopy and Imaging, Key Lab of Terahertz Optoelectronics, Ministry of Education, and Beijing Advanced Innovation Center for Imaging Technology, Department of Physics, Capital Normal University, Beijing 100048, China.
Abstract:
Infrared thermal imaging is a promising nondestructive technique for thickness prediction. However, it is usually thought to be only appropriate for testing the thickness of thin objects or near-surface structures. In this study, we present a new two-sided step-heating thermal imaging method which employed a low-cost portable halogen lamp as the heating source and verified it with two stainless steel step wedges with thicknesses ranging from 5 mm to 24 mm. We first derived the one-dimensional step-heating thermography theory with the consideration of warm-up time of the lamp, and then applied the nonlinear regression method to fit the experimental data by the derived function to determine the thickness. After evaluating the reliability and accuracy of the experimental results, we concluded that this method is capable of testing thick objects. In addition, we provided the criterions for both the required data length and the applicable thickness range of the testing material. It is evident that this method will broaden the thermal imaging application for thickness measurement.
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