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Thermal expansion and Thermal stress: Problem Solving01:27

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San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
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Thermal strain is a concept that arises when we consider how temperature changes affect structures. Unlike the conventional assumption that structures remain constant under load, real-world scenarios often involve temperature fluctuations that can significantly impact these structures. Consider a homogeneous rod with a uniform cross-section resting freely on a flat horizontal surface. If the rod's temperature increases, the rod elongates. This elongation is proportional to the temperature...
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Quantitative thermal imaging using single-pixel Si APD and MEMS mirror.

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    Area of Science:

    • Optical Engineering
    • Instrumentation
    • Materials Science

    Background:

    • Focal-plane array (FPA) sensors struggle with accurate quantitative temperature measurements due to internal reflections and pixel calibration challenges.
    • The size-of-source effect (SSE) and external field-of-view (FOV) interference increase measurement uncertainty in infrared thermometry.
    • Existing methods like glare stops are ineffective at mitigating SSE.

    Purpose of the Study:

    • To develop a scanning thermal imaging camera using MEMS mirrors to reduce measurement uncertainty.
    • To demonstrate a flexible imaging approach using a silicon avalanche photodiode (APD) for enhanced low-temperature measurement.
    • To compare the performance of the novel scanning system against traditional FPA-based cameras.

    Main Methods:

    • Implementation of a micromechanical systems (MEMS) mirror-based scanning thermal imaging system.
    • Utilization of a silicon avalanche photodiode (Si APD) for near-infrared (NIR) thermal detection at 1 µm.
    • Comparative analysis of measurement uncertainty and SSE reduction against a commercial bolometer FPA camera and a Si photodiode.

    Main Results:

    • The scanning approach reduced SSE-related temperature error by 66 °C for an 800 °C target when aperture diameter increased from 10 to 20 mm.
    • The Si APD instrument achieved measurement uncertainty of ± 0.5 °C (D*-related) for temperatures below 700 °C at NIR wavelengths.
    • Demonstrated capability for measuring lower target temperatures compared to conventional FPA systems.

    Conclusions:

    • MEMS mirror-based scanning thermal imaging offers reduced measurement uncertainty and improved accuracy over FPA systems.
    • The Si APD-based NIR thermal camera provides a viable alternative for precise quantitative temperature measurements, especially at lower temperatures.
    • This flexible scanning approach effectively mitigates the size-of-source effect, enhancing the reliability of infrared thermometry.