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Related Concept Videos

Valence Bond Theory02:42

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Coordination compounds and complexes exhibit different colors, geometries, and magnetic behavior, depending on the metal atom/ion and ligands from which they are composed. In an attempt to explain the bonding and structure of coordination complexes, Linus Pauling proposed the valence bond theory, or VBT, using the concepts of hybridization and the overlapping of the atomic orbitals. According to VBT, the central metal atom or ion (Lewis acid) hybridizes to provide empty orbitals of suitable...
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According to valence bond theory, a covalent bond results when: (1) an orbital on one atom overlaps an orbital on a second atom, and (2) the single electrons in each orbital combine to form an electron pair. The strength of a covalent bond depends on the extent of overlap of the orbitals involved. Maximum overlap is possible when the orbitals overlap on a direct line between the two nuclei.
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The mathematical expression known as the wave function, ψ, contains information about each orbital and the wavelike properties of electrons in an isolated atom. When atoms are bound together in a molecule, the wave functions combine to produce new mathematical descriptions that have different shapes. This process of combining the wave functions for atomic orbitals is called hybridization and is mathematically accomplished by the linear combination of atomic orbitals. The new orbitals that...
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Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”. 
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Hybridization of Atomic Orbitals II03:35

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Related Experiment Video

Updated: Feb 13, 2026

Hybrid De Novo Genome Assembly for the Generation of Complete Genomes of Urinary Bacteria using Short- and Long-read Sequencing Technologies
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Second Generation Small Pixel Technology Using Hybrid Bond Stacking.

Vincent C Venezia1, Alan Chih-Wei Hsiung2, Wu-Zang Yang3

  • 1OmniVision Technologies, Inc., Santa Clara, CA 95054, USA. vincentv@ovt.com.

Sensors (Basel, Switzerland)
|March 3, 2018
PubMed
Summary
This summary is machine-generated.

OmniVision

Keywords:
0.9 µm1.0 µmBSICISNIRhybrid-bondstacked

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Area of Science:

  • Semiconductor device physics
  • Image sensor technology

Background:

  • Review of OmniVision's second generation (Gen2) Back-Side Stacked (BSI) technologies.
  • Focus on advancements in small-pixel image sensor technology.

Purpose of the Study:

  • To review OmniVision's Gen2 small-pixel BSI stacking technologies.
  • To highlight key features and performance improvements.

Main Methods:

  • Review of hybrid-bond stacking.
  • Analysis of deeper back-side structures.
  • Examination of deep-trench isolation.
  • Evaluation of new back-side composite metal-oxide grid.
  • Assessment of improved gate oxide quality.

Main Results:

  • Gen2 technology achieves state-of-the-art low-light performance for 1.1, 1.0, and 0.9 µm pixel products.
  • Achieved less than 100 parts per million (ppm) white-pixel process.
  • Incorporated high near-infrared (NIR) Quantum Efficiency (QE) technology.

Conclusions:

  • OmniVision's Gen2 BSI stacking technology offers significant advancements in small-pixel image sensors.
  • The technology enables superior low-light performance and high NIR QE.
  • Improvements address key challenges in modern image sensor design.