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Extremely Low Frequency-Magnetic Field (ELF-MF) Exposure Characteristics among Semiconductor Workers
Sangjun Choi1, Wonseok Cha2, Jihoon Park3
1Department of Occupational Health, Daegu Catholic University, Gyeongsan 38430, Korea. junilane@gmail.com.
Semiconductor workers face significant extremely low frequency-magnetic field (ELF-MF) exposure, particularly during diffusion and chip testing. Job roles and specific activities substantially influence these ELF-MF exposure levels.
Area of Science:
- Occupational Health
- Electromagnetic Field Exposure
- Semiconductor Industry Safety
Background:
- Semiconductor manufacturing involves potential exposure to electromagnetic fields.
- Understanding extremely low frequency-magnetic field (ELF-MF) exposure is crucial for worker safety.
- Previous research has not fully detailed ELF-MF exposure across various semiconductor roles.
Purpose of the Study:
- To quantify ELF-MF exposure in semiconductor workers.
- To identify job characteristics and activities associated with higher ELF-MF exposure.
- To inform targeted risk mitigation strategies in semiconductor fabrication and packaging.
Main Methods:
- Personal dosimeters and portable monitoring devices were used to measure ELF-MF.
- Exposure was assessed for 117 workers in wafer fabrication and chip packaging.
- Measurements were categorized by operation, job, and specific working activities.
Main Results:
- Average ELF-MF exposure levels were 0.56 µT (fab), 0.59 µT (packaging), and 0.89 µT (electrical engineers).
- Diffusion and chip testing activities resulted in the highest ELF-MF exposure.
- Operators in diffusion, ion implantation, module, and testing operations showed the highest quartile exposure levels.
Conclusions:
- ELF-MF exposure in semiconductor workers is significantly influenced by job type and specific tasks.
- Certain operations and activities present higher risks for ELF-MF exposure.
- Findings highlight the need for tailored safety protocols based on job roles and work activities.
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