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Advanced surface control enables precise grapho-epitaxy directed self-assembly (DSA) for semiconductor patterning. This method ensures uniform polymer thickness, crucial for reliable pattern transfer in advanced manufacturing.

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Semiconductor Manufacturing

Background:

  • Directed self-assembly (DSA) is a key technique for advanced semiconductor patterning.
  • Grapho-epitaxy relies on topographical guiding structures to direct DSA.
  • Controlling surface affinity within these structures is critical for reliable patterning.

Purpose of the Study:

  • To achieve independent surface affinity control in grapho-epitaxy guiding structures.
  • To evaluate and optimize a novel integration method for DSA grapho-epitaxy.
  • To improve the reliability and uniformity of DSA-based semiconductor patterning.

Main Methods:

  • Embedding an ultrathin layer with tunable surface properties within the guiding template stack.
  • Utilizing a thin protective layer to preserve embedded layer properties during etching.
  • Characterization using critical dimension scanning electron microscopy (CD-SEM) and focused ion beam-scanning transmission electron microscopy (FIB-STEM).
  • Evaluation of DSA performance on 300 mm wafers using 193 nm immersion lithography.

Main Results:

  • Independent control of surface affinity on the bottom and sidewalls of guiding structures was achieved.
  • A protective layer successfully preserved the embedded layer's surface properties during etching.
  • Controlled polymer residual thickness (few nanometers) and uniformity (inferior to 1 nm) at the guiding template bottom.
  • Demonstrated high success rates and critical dimension uniformity for shrunk contacts.

Conclusions:

  • The novel integration method provides advanced surface affinity control for grapho-epitaxy DSA.
  • This approach enhances the reliability and uniformity of semiconductor patterning processes.
  • The controlled polymer residual thickness facilitates subsequent DSA pattern transfer, advancing semiconductor manufacturing.