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An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Pouria Aryan1, Santhakumar Sampath2, Hoon Sohn3

  • 1Department of Civil and Environmental Engineering, KAIST, 291 Daehakro, Yuseong-gu, Daejeon 34141, Korea. pouria.aryan@kaist.ac.kr.

Sensors (Basel, Switzerland)
|June 24, 2018
PubMed

Keywords:
IC packagingX-raydefect detectionnon-destructive testingscanning acoustic microscopysurface acoustic wavesthermographyultrafast laser

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