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Updated: Feb 8, 2026

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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3D high resolution imaging for microelectronics: A multi-technique survey on copper pillars.

A Fraczkiewicz1, F Lorut2, G Audoit1

  • 1Univ. Grenoble Alpes, Grenoble F-38000, France; CEA, LETI, MINATEC Campus, Grenoble F-38054, France.

Ultramicroscopy
|June 30, 2018
PubMed
Summary

3D integration in microelectronics requires advanced imaging. This study compares destructive and non-destructive 3D characterization techniques for copper pillars, finding lab-based methods suit spot checks and synchrotron imaging suits batch analysis.

Keywords:
3D imaging3D integrationCopper pillarsSlice and viewSynchrotronX-ray tomography

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Area of Science:

  • Microelectronics
  • Materials Science
  • Advanced Imaging Techniques

Background:

  • 3D integration in microelectronics enables vertical stacking of dice or wafers for space-saving.
  • The increasing adoption of 3D integration necessitates the development and assessment of advanced 3D imaging techniques.
  • Copper pillars are critical components for interconnecting stacked components in 3D integrated circuits.

Purpose of the Study:

  • To evaluate and compare various 3D characterization techniques for analyzing copper pillars used in microelectronic 3D integration.
  • To assess both destructive and non-destructive imaging methods for their suitability in microelectronics applications.
  • To provide insights into the resolution and sample throughput trade-offs of different 3D imaging modalities.

Main Methods:

  • Destructive techniques: Focused Ion Beam/Scanning Electron Microscopy (FIB/SEM), FIB/FIB, and Plasma Focused Ion Beam/Plasma Focused Ion Beam (PFIB/PFIB) slice-and-view protocols.
  • Non-destructive techniques: Laboratory-based computed tomography (CT) and synchrotron-based computed tomography.
  • Comparative analysis focusing on resolution, throughput, and applicability to copper pillar characterization.

Main Results:

  • Destructive techniques like FIB/SEM and PFIB/PFIB offer high-resolution cross-sectional views but are time-consuming and sample-destructive.
  • Laboratory-based CT is suitable for rapid, punctual analysis of individual copper pillars.
  • Synchrotron-based CT provides highly resolved 3D volumes, making it ideal for analyzing larger batches of samples efficiently.

Conclusions:

  • The choice of 3D characterization technique for microelectronic copper pillars depends on specific industry needs, such as analysis scope and sample volume.
  • Laboratory-based imaging is effective for targeted, single-sample investigations.
  • Synchrotron-based computed tomography is the preferred method for high-throughput, detailed volumetric analysis of multiple samples in 3D integration research and development.