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Updated: Feb 8, 2026
07:40
Assay of Adhesion Under Shear Stress for the Study of T Lymphocyte-Adhesion Molecule Interactions
Published on: June 29, 2016
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Stress Dissipation in Cucurbit[8]uril Ternary Complex Small Molecule Adhesives
Paul E Williams1, Zarah Walsh-Korb1, Samuel T Jones1
1Melville Laboratory for Polymer Synthesis, Department of Chemistry , University of Cambridge , Lensfield Road , Cambridge CB2 1EW , United Kingdom.
Langmuir : the ACS Journal of Surfaces and Colloids
|July 3, 2018
Summary
This study demonstrates photoreversible adhesives using cucurbit[8]uril (CB[8]) to control self-assembly for dynamic surface adhesion. This offers insights into stress dissipation in responsive materials.
Area of Science:
- Supramolecular chemistry
- Materials science
- Surface science
Background:
- Responsive, reversible adhesives are crucial for applications requiring controlled stress management between surfaces.
- Supramolecular self-assembly offers a pathway to engineer dynamic adhesive properties.
Purpose of the Study:
- To investigate the use of cucurbit[8]uril (CB[8]) in creating photoreversible adhesives.
- To understand the relationship between molecular interactions and macroscopic adhesion behavior.
Main Methods:
- Functionalized mica substrates were adhered using cucurbit[8]uril (CB[8]).
- Photoreversible CB[8] heteroternary complexes were utilized to form surface-surface interactions.
- Adhesion was characterized at single-molecule, bulk, and macroscopic levels.
Main Results:
- Cucurbit[8]uril (CB[8]) successfully mediated direct adhesion between mica surfaces.
- Photoreversible complexes enabled controlled assembly and disassembly of the adhesive interface.
- Analysis revealed insights into cooperativity and stress dissipation mechanisms.
Conclusions:
- Photoreversible cucurbit[8]uril (CB[8]) systems provide a viable strategy for dynamic, responsive adhesives.
- Understanding adhesion at multiple scales is key to designing efficient stress-broker materials.
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