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A ±0.3 ppm Oven-Controlled MEMS Oscillator Using Structural Resistance-Based Temperature Sensing.

Chang-Shun Liu, Roozbeh Tabrizian, Farrokh Ayazi

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

|July 12, 2018

Summary

This summary is machine-generated.

This study introduces a silicon microelectromechanical-systems oven-controlled oscillator (MEMS OCXO) utilizing the resonator's structural resistance as an embedded temperature sensor for precise frequency stabilization. The novel MEMS OCXO achieves excellent frequency stability across a wide temperature range.

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Area of Science:

Electrical Engineering
Materials Science
Physics

Background:

Traditional Oven-Controlled Crystal Oscillators (OCXOs) are bulky and power-hungry.
Miniaturization of high-performance frequency standards is crucial for modern electronics.
Microelectromechanical Systems (MEMS) offer a pathway to smaller, more efficient oscillators.

Purpose of the Study:

To develop a compact, high-stability MEMS OCXO.
To integrate a self-temperature sensing capability directly into the resonator.
To achieve precise frequency control using a micro-oven and digital calibration.

Main Methods:

Fabrication of a high-Q capacitive Lamé-mode resonator using the HARPSS process.
Integration of a silicon resistor micro-oven and an embedded resistance temperature detector (RTD) on the MEMS die.
Implementation of an analog control loop with a digital feedforward calibration path.

Main Results:

Achieved a 77.7-MHz MEMS OCXO with ±0.3-ppm frequency stability over -25 °C to 85 °C.
Demonstrated effective temperature stabilization using the integrated micro-oven and RTD.
The system consumed 16 mA from a 3.2-V supply.

Conclusions:

The developed MEMS OCXO offers a highly stable and miniaturized frequency reference.
Using structural resistance as a self-temperature sensor is a viable technique for MEMS OCXO.
This technology has potential applications in portable and space-constrained electronic devices.