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A Modular Solder System with Hierarchical Morphology and Backward Compatibility
Han Bit Lee1, Young Won Kim1, Sang Hoon Kim1
1Digital Manufacturing Process Group, Korea Institute of Industrial Technology, 113-58 Seohaean-ro, Siheung-si, Gyeonggi-do, 15014, Republic of Korea.
Small (Weinheim an Der Bergstrasse, Germany)
|July 19, 2018
Summary
A novel modular solder system enhances reflowability, oxidation resistance, and conductivity on heat-sensitive substrates. This hierarchical micro/nanostructure design offers tunable properties for advanced electronic applications.
Area of Science:
- Materials Science
- Nanotechnology
- Surface Engineering
Background:
- Traditional solders face limitations with heat-sensitive substrates.
- Developing advanced solder systems with improved properties is crucial for flexible electronics.
Purpose of the Study:
- To report a modular solder system with hierarchical micro/nanofeatures.
- To enhance reflowability, oxidation resistance, and electrical conductivity.
- To demonstrate a design approach with backward compatibility for iterative improvement.
Main Methods:
- Fabrication of a modular solder system with nanoparticles on micropowders.
- Engineering core-shell nanostructures for property enhancement.
- Incorporation of polymer additives (e.g., PEDOT:PSS) and oxide nanostructures (e.g., CuO@CeO2).
Main Results:
- Achieved pronounced reflow on flexible Au-coated PET at 110 °C using In-Sn-Bi nanoparticles on Sn-Zn micropowders.
- Demonstrated increased oxidation resistance and electrical conductivity through CuO@CeO2 nanostructures and PEDOT:PSS.
- Modular design allows for property tuning by altering constituent structure and composition.
Conclusions:
- The modular solder system offers superior performance on heat-sensitive substrates.
- The hierarchical micro/nanostructure design provides a versatile platform for advanced solder development.
- Backward compatibility enables continuous improvement of solder properties for future applications.
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