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Related Experiment Video

Updated: Feb 7, 2026

Characterization of Thermal Transport in One-dimensional Solid Materials

Characterization of Thermal Transport in One-dimensional Solid Materials

Published on: January 26, 2014

Thermal Transport across SiC-Water Interfaces.

C Ulises Gonzalez-Valle¹, Satish Kumar², Bladimir Ramos-Alvarado¹

¹Department of Mechanical and Nuclear Engineering , The Pennsylvania State University , University Park , Pennsylvania 16802 , United States.

ACS Applied Materials & Interfaces

|August 1, 2018

Summary

Investigating silicon carbide (SiC) and water interfaces reveals that liquid structuring significantly impacts thermal transport. Understanding this interfacial behavior is key for optimizing heat transfer in SiC-water systems.

Keywords:

heat transfer molecular dynamics silicon carbide thermal boundary conductance thermal boundary resistance wettability

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Area of Science:

Materials Science
Surface Science
Computational Physics

Background:

Understanding thermal transport at solid-liquid interfaces is crucial for various applications.
Silicon carbide (SiC) is a key material in many thermal management systems.
Interfacial properties significantly influence overall heat transfer efficiency.

Purpose of the Study:

To investigate thermal transport across 3C-type silicon carbide (SiC) and water interfaces.
To analyze the effects of crystallographic planes and surface terminations on interfacial heat transfer.
To explore the relationship between wettability and thermal transport.

Main Methods:

Nonequilibrium classical molecular dynamics simulations were employed.
Analysis included various crystallographic planes and atomic surface terminations of SiC.
Interfacial bonding strength was modified to simulate hydrophilic and hydrophobic conditions.

Main Results:

Observed liquid structuring near the SiC surface, sensitive to termination, wettability, and temperature.
Found that interfacial heat transfer and wetting properties are not directly correlated.
Demonstrated that liquid structuring is essential for a comprehensive description of interfacial heat transfer.

Conclusions:

Interfacial heat transfer in SiC-water systems is complex and influenced by liquid-phase structuring.
The density depletion length can reconcile thermal boundary conductance calculations.
Accurate modeling requires considering molecular structuring at the solid-liquid interface.