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Experiments on Temperature Changes of Microbolometer under Blackbody Radiation and Predictions Using Thermal Modeling
Yu-Zhen Deng1, Shiang-Feng Tang2, Hong-Yuan Zeng3
1Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan 33000, Taiwan. jcoh185@gmail.com.
This study simulates heat transfer in microbolometer devices. L-type 2-leg microbolometers show a larger temperature difference (ΔT) than 4-leg designs, indicating potential for improved thermal isolation in infrared detection.
Area of Science:
- Thermal Engineering
- Materials Science
- Optics
Background:
- Microbolometers are crucial for infrared imaging.
- Understanding heat transfer is key to optimizing microbolometer performance.
- Vanadium oxide is a common material for microbolometer sensing elements.
Purpose of the Study:
- To simulate and analyze heat transfer in novel L-type microbolometer designs.
- To compare the thermal performance of 2-leg versus 4-leg microbolometer structures.
- To investigate the effect of structural modifications on temperature distribution.
Main Methods:
- Utilized COMSOL Multiphysics for heat transfer modeling.
- Simulated microbolometer devices with vanadium oxide membranes and Si₃N₄ supporting films.
- Analyzed temperature changes under blackbody radiation.
Main Results:
- Simulated temperature trends align with experimental resistance changes.
- Nominal 2-leg microbolometers exhibited a larger ΔT (≈ 17 mK) compared to 4-leg designs.
- 4-leg microbolometers showed a smaller ΔT (≈ 5 mK) due to higher thermal conductance.
Conclusions:
- The 2-leg microbolometer design offers superior thermal isolation.
- 4-leg designs provide higher thermal conductance, impacting temperature differentials.
- Simulation results provide a basis for optimizing microbolometer thermal management.
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