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Updated: Feb 6, 2026
06:34
Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
Published on: September 19, 2020
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Heat-Resistant Ferroelectric-Polymer Nanocomposite with High Dielectric Constant
Nikolay Mukhin1, Valentin Afanasjev2, Irina Sokolova3
1Institute of Micro and Sensor Systems, Otto von Guericke University of Magdeburg, 39106 Magdeburg, Germany. mukhin.nikolay.v@gmail.com.
Materials (Basel, Switzerland)
|August 17, 2018
Summary
Researchers developed a heat-resistant ferroelectric-polymer nanocomposite for stable planar layers. This material exhibits excellent thermal stability and electrical properties, suitable for microelectronic film capacitors.
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Developing advanced materials for microelectronics is crucial.
- High dielectric constant materials are needed for efficient capacitors.
- Heat-resistant and chemically stable layers are required for robust electronic devices.
Purpose of the Study:
- To develop a novel ferroelectric-polymer nanocomposite.
- To create heat-resistant and chemically stable planar layers.
- To evaluate the electrical and thermal properties of the developed nanocomposite.
Main Methods:
- Synthesis of ferroelectric-polymer nanocomposite.
- Characterization of dielectric constant and loss factor.
- Thermal stability testing up to 250 °C.
- Analysis of dielectric frequency spectra.
Main Results:
- Achieved a high dielectric constant (30-400) and a loss factor (0.04-0.1).
- The nanocomposite demonstrated thermal stability of electrical parameters up to 250 °C.
- Dielectric frequency spectra showed two distinct peaks, differing from individual components.
Conclusions:
- The developed ferroelectric-polymer nanocomposite offers superior heat resistance and chemical stability.
- The material's electrical properties remain stable at elevated temperatures.
- This nanocomposite is a promising candidate for built-in film capacitors in microelectronic applications.
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