GeSn lateral p-i-n photodetector on insulating substrate
Optics Express
|August 19, 2018
Summary
Researchers demonstrated the first germanium-tin (GeSn) photodetector on a novel GeSn-on-insulator (GeSnOI) substrate. This device detects light beyond 2 µm, showing promise for integrated nano-electronics and photonics.
Area of Science:
- Optoelectronics
- Materials Science
- Semiconductor Devices
Background:
- Germanium-tin (GeSn) alloys are emerging materials for optoelectronic applications due to their tunable bandgap.
- Integration of GeSn with silicon photonics requires advanced substrate engineering.
- GeSn-on-insulator (GeSnOI) substrates offer a pathway for heterogeneous integration.
Purpose of the Study:
- To experimentally demonstrate the first lateral p-i-n photodetector fabricated on a novel GeSnOI substrate.
- To evaluate the performance characteristics of the GeSnOI photodetector at room temperature.
- To assess the detection capabilities of the device for infrared wavelengths.
Main Methods:
- Fabrication of GeSnOI substrate using direct wafer bonding and layer transfer techniques.
- Fabrication of lateral p-i-n photodetectors on the GeSnOI substrate.
- Electrical and optical characterization of the fabricated photodetectors.
Main Results:
- Successful demonstration of a lateral p-i-n photodetector on a GeSnOI substrate.
- The photodetector exhibited well-behaved diode characteristics with a high on/off current ratio (~4 orders of magnitude at ± 1 V) at room temperature.
- Achieved a cutoff detection wavelength beyond 2 µm with a photoresponsivity of 0.016 A/W at 2004 nm.
Conclusions:
- The developed GeSnOI substrate is a promising platform for large-scale integration of nano-electronic and photonic devices.
- The GeSnOI photodetector demonstrates effective infrared detection capabilities, suitable for various sensing applications.
- This work paves the way for advanced GeSn-based optoelectronic integrated circuits.
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