Utilization of Resist Stencil Lithography for Multidimensional Fabrication on a Curved Surface

The limited ability to fabricate nanostructures on nonplanar rugged surfaces has severely hampered the applicability of many emerging technologies. Here we report a resist stencil lithography based approach for in situ fabrication of multidimensional nanostructures on both planar and uneven substrates. By using the resist film as a flexible stencil to form a suspending membrane with predesigned patterns, a variety of nanostructures have been fabricated on curved or uneven substrates of diverse morphologies on demand. The ability to realize 4 in. wafer scale fabrication of nanostructures as well as line width resolution of sub-20 nm is also demonstrated. Its extraordinary capacity is highlighted by the fabrication of three-dimensional wavy nanostructures with diversified cell morphologies on substrates of different curvatures. A robust general scheme is also developed to construct various complex 3D nanostructures. The use of conventional resists and processing ensures the versatility of the method. Such an in situ lithography technique has offered exciting possibilities to construct nanostructures with high dimensionalities that can otherwise not be achieved with existing nanofabrication methods.