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Updated: Feb 5, 2026
08:50
Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management
Published on: September 2, 2015
9.5K
Thermal management of epidermal electronic devices/skin system considering insensible sweating
Shuang Nie1, Chenxi Zhang1, Jizhou Song2
1Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou, 310027, China.
Scientific Reports
|September 22, 2018
Summary
This study develops a thermal model for epidermal electronics devices (EEDs) and skin. It provides design guidelines to prevent thermal discomfort and optimize EED performance.
Area of Science:
- Biomedical Engineering
- Thermal Science
- Materials Science
Background:
- Epidermal electronics devices (EEDs) require effective thermal management to prevent skin discomfort.
- Temperature increases of even a few degrees can cause significant thermal discomfort for users.
Purpose of the Study:
- To develop an analytical thermal model for the EED/skin system.
- To investigate the impact of EED properties on skin temperature.
- To provide design guidelines for thermal comfort in EEDs.
Main Methods:
- Developed a 3D analytical thermal model considering insensible sweating.
- Validated the model using finite element analysis.
- Investigated parameter influences on maximum skin temperature.
Main Results:
- Derived analytical expressions for steady-state temperature distributions.
- Identified key parameters like substrate thickness and thermal conductivity affecting skin temperature.
- Established correlations between EED properties and thermal comfort.
Conclusions:
- The developed model provides a theoretical foundation for EED thermal management.
- Design guidelines can optimize EEDs to avoid adverse thermal effects.
- This research is crucial for the practical application of EEDs.
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