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Updated: Feb 4, 2026

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
B M Guy1, J A Richards1, D J M Hodgson1
1SUPA, School of Physics and Astronomy, The University of Edinburgh, King's Buildings, Peter Guthrie Tait Road, Edinburgh EH9 3FD, United Kingdom.
This study introduces a new model for granular suspension rheology, explaining flow curves and predicting viscosity singularities using particle interaction constraints. The model offers a general description of suspension flow, independent of specific microphysics.
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