Flexible Films of Covalent Organic Frameworks with Ultralow Dielectric Constants under High Humidity
Pengpeng Shao1, Jie Li1, Fan Chen1
1Department Beijing Key Laboratory of Photoelectronic/Electrophotonic Conversion Materials, Key Laboratory of Cluster Science, Ministry of Education, School of Chemistry and Chemical Engineering, Beijing Institute of Technology, Beijing, 100081, P. R. China.
Abstract:
Covalent organic framework (COF) films combine the processability of polymers with the porosity and atomic precision of crystalline porous materials, properties that are long-sought-after in electronics yet hard to realize. Herein, we prepared four flexible COF films with different alkoxy side chains via interfacial polymerization. The COF films exhibit an ultralow dielectric constant (κ=1.19±0.04 at 105 Hz), small dielectric loss (<0.02, 103 -106 Hz), high breakdown voltage (>63 kV cm-1 ) and low leakage current (10-10 A cm-2 at 1 kV cm-1 ). They have considerable mechanical strength, and ability to withstand high humidity (RH 70 % for 10 days) and repeated bending (1000 times) without losing their dielectric properties. Extension of the alkoxy chains reduces the film's κ and enhances its moisture resistance, while incorporation of guest molecules further increase the κ value up to 43 times.
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