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A 250 m Direct Time-of-Flight Ranging System Based on a Synthesis of Sub-Ranging Images and a Vertical Avalanche
Yutaka Hirose1, Shinzo Koyama2, Motonori Ishii3
1Panasonic Corporation, 1 Kotari-yakemachi, Nagaokakyo City, Kyoto 617-8520, Japan. hirose.yutaka@jp.panasonic.com.
A new Complementary Metal Oxide Semiconductor (CMOS) image sensor (CIS) achieves 250m ranging with 10cm resolution using vertical avalanche photodiodes (VAPD). This direct time-of-flight (TOF) sensor offers superior depth imaging capabilities.
Area of Science:
- Optoelectronics
- Image Sensors
- Photonics
Background:
- Conventional light detection and ranging (LiDAR) systems often suffer from insufficient resolution and limited range.
- Indirect CMOS image sensor (CIS) time-of-flight (TOF) technologies typically have a restricted operational distance.
Purpose of the Study:
- To develop a novel direct TOF CIS with extended ranging capabilities and high resolution.
- To overcome the limitations of existing LiDAR and indirect TOF CIS technologies.
Main Methods:
- A 688 × 384 pixels array of vertical avalanche photodiodes (VAPD) was utilized in the CIS.
- Each pixel incorporates a VAPD with a four-transistor circuit and an analog capacitor for avalanche pulse accumulation.
- High-power, near-infrared (NIR) laser pulses (<50 ns, 6 kHz) were employed, with global VAPD gating for sub-photon level signal detection.
Main Results:
- Achieved depth map imaging with 10 cm lateral resolution over a range of 1 m to 250 m.
- Successfully synthesized sub-range images from photon counts to create a comprehensive depth map.
- Demonstrated the capability to count individual avalanche pulses for precise signal extraction.
Conclusions:
- The developed direct TOF CIS offers a significant advancement over conventional LiDAR and indirect TOF systems in terms of resolution and range.
- The in-pixel circuit design enables high-sensitivity detection and accurate depth measurement.
- This technology has the potential to replace existing solutions in applications requiring long-range, high-resolution 3D imaging.
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