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Characterization of Thermal Transport in One-dimensional Solid Materials
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Hollow-Structured Materials for Thermal Insulation.

Feng Hu1, Siyu Wu1, Yugang Sun1

  • 1Department of Chemistry, Temple University, 1901 North 13th Street, Philadelphia, PA, 19122, USA.

Advanced Materials (Deerfield Beach, Fla.)
|November 1, 2018
PubMed
Summary
This summary is machine-generated.

Hollow-structured materials (HSMs) offer excellent thermal insulation by incorporating gaseous voids to reduce heat transfer. Optimizing void size below 350 nm enhances thermal conductivity reduction due to confinement effects.

Keywords:
aerogelshollow-structured materialspolymer foamssilica nanoshellsthermal-insulation materials

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Area of Science:

  • Materials Science
  • Energy Science
  • Nanotechnology

Background:

  • Heating and cooling are major energy consumers, necessitating efficient thermal insulation.
  • Thermal insulation materials reduce energy waste by lowering thermal conductivity.
  • Hollow-structured materials (HSMs) utilize gaseous voids to disrupt heat transport pathways.

Purpose of the Study:

  • To provide an overview of recent advancements in developing hollow-structured materials for thermal insulation.
  • To summarize strategies for creating gaseous voids in solid materials for HSM synthesis.
  • To analyze the relationship between void characteristics and thermal conductivity in HSMs.

Main Methods:

  • Reviewing and analyzing recent literature on hollow-structured materials for thermal insulation.
  • Investigating synthesis strategies for creating gaseous voids in solid matrices.
  • Systematically analyzing documented results on thermal conductivity versus void size and density.

Main Results:

  • Hollow-structured materials effectively lower thermal conductivity by incorporating high-density gaseous voids.
  • Reducing void size below approximately 350 nm is particularly effective in decreasing thermal conductivity.
  • This enhanced performance is attributed to potential confinement effects in nanometer-sized voids.

Conclusions:

  • Hollow-structured materials are a promising class of materials for advanced thermal insulation.
  • Controlling void size, especially below 350 nm, is crucial for maximizing thermal insulation performance.
  • Further research is needed to address challenges and explore future applications of HSMs.