PMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices

Area of Science:

• Materials Science
• Microfluidics Engineering

Background:

• Thermoplastic polymers are increasingly favored for microfluidic chip fabrication due to ease of manufacturing and affordability.
• Established methods like laser machining, injection molding, and hot embossing are used for polymer microfluidic device creation.

Purpose of the Study:

• To introduce and validate a new adhesive bonding process for dissimilar polymers in microfluidic applications.
• To demonstrate the efficacy of a polymethyl methacrylate (PMMA) solution as an adhesive layer for bonding PMMA to polycarbonate (PC).

Main Methods:

• A 2.5% (w/w) PMMA solution was employed as an adhesive layer to bond PMMA microfluidic channels with a PC film.
• Bonding strength was evaluated using shear strength tests and a crack opening method.
• Fluidic leakage inspection was performed to assess the integrity of the bonded interface.

Main Results:

• The developed technique successfully bonded PMMA microchips to PC films.
• Shear strength tests and crack opening methods provided quantitative data on bond durability.
• Fluidic leakage tests confirmed the sealing performance of the new bonding process.

Conclusions:

• The PMMA solution-based bonding method offers a viable and effective approach for fabricating polymer microfluidic devices with dissimilar materials.
• This technique provides robust and leak-free seals, enhancing the reliability of polymer microfluidic systems.
• The study highlights a cost-effective and straightforward method for assembling complex microfluidic devices.