PMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices

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Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
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Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

Published on: January 17, 2017

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In-Hyouk Song1, Taehyun Park2

  • 1Department of Engineering Technology, Texas State University, San Marcos, TX 78666, USA. in-hyouk.song@txstate.edu.

Micromachines
|November 8, 2018
PubMed

Keywords:
PMMA–PC bondinghybrid bondingmicrofluidicpolymethyl methacrylate (PMMA) spin coated polycarbonate (PC)thermal bonding

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