Fabrication of Dish-Shaped Micro Parts by Laser Indirect Shocking Compound Process

Area of Science:

• Materials Science
• Manufacturing Engineering
• Microfabrication

Background:

• Micro-scale compound process technology faces challenges in tool manufacturing, part transport, and punch-die alignment.
• Existing methods for micro-scale forming are limited, hindering the production of complex micro-parts.

Purpose of the Study:

• To introduce a novel compound process combining laser shock waves and soft punches for micro-part fabrication.
• To overcome the limitations of traditional micro-scale manufacturing techniques.

Main Methods:

• Developed a novel compound process integrating deep drawing, punching, and blanking.
• Utilized laser shock wave technology with varying soft punch thicknesses (up to 200 μm) on copper.
• Investigated the effect of laser energy (1550 mJ) and soft punch thickness on micro-part quality.

Main Results:

• Achieved simultaneous deep drawing, punching, and blanking in a single process.
• Optimized laser energy at 1550 mJ and soft punch thickness of 200 μm yielded the best morphology, deformation depth, dimensional accuracy, and surface roughness.
• Elastic wave theory explained why thicker punches hindered the process.

Conclusions:

• The novel laser shock wave and soft punch compound process effectively fabricates dish-shaped micro-parts from copper.
• A soft punch thickness of 200 μm is optimal, balancing process efficiency and part quality.
• This method offers a precise and efficient solution for micro-scale manufacturing challenges.