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An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices

Yao Gong1, Jang Min Park2, Jiseok Lim3

  • 1School of Mechanical Engineering, Yeungnam University, Daehakro 280, Gyeongsan, 38541 Gyeongbuk, Korea. manyjoy321@gmail.com.

Micromachines
|November 9, 2018
PubMed

Keywords:
injection moldinginterference fitlab-on-a-chipthermal bonding

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