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CMOS MEMS Fabrication Technologies and Devices.

Hongwei Qu1

  • 1Department of Electrical and Computer Engineering, Oakland University, 2200 N. Squirrel Road, Rochester, MI 48309, USA. qu2@oakland.edu.

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Summary

This review explores complementary metal-oxide-semiconductor micro-electro-mechanical systems (CMOS MEMS) fabrication technologies for sensors and actuators. It covers monolithic integration, focusing on typical devices and industrial/research results.

Keywords:
CMOS (complementary metal-oxide-semiconductor)CMOS MEMSMEMS (micro-electro-mechanical systems)actuatorsintegrationsensors

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Mechanical Engineering

Background:

  • Micro-electro-mechanical systems (MEMS) offer miniaturized solutions for sensing and actuation.
  • Complementary metal-oxide-semiconductor (CMOS) technology provides a scalable platform for integrated circuits.
  • Combining CMOS and MEMS enables highly integrated and functional microdevices.

Purpose of the Study:

  • To review CMOS MEMS fabrication technologies and the microdevices they enable.
  • To classify fabrication approaches based on CMOS circuitry and MEMS element sequencing.
  • To focus on monolithic integration of CMOS and MEMS.

Main Methods:

  • Classification of CMOS MEMS fabrication technologies.
  • Separate introduction of Silicon-on-Insulator (SOI) CMOS MEMS.
  • Description of associated devices and their fabrication processes.

Main Results:

  • Detailed review of CMOS MEMS fabrication, classified by integration sequence.
  • Inclusion of Silicon-on-Insulator (SOI) CMOS MEMS.
  • Focus on typical sensors (pressure, inertial) and actuators, excluding wafer-bonding.
  • Coverage of both industrial products and research findings.

Conclusions:

  • CMOS MEMS fabrication offers diverse pathways for microdevice development.
  • Monolithic integration is a key focus, enabling advanced sensors and actuators.
  • The review provides a comprehensive overview of current CMOS MEMS technologies and applications.