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Wen-Cheng Kuo1, Chih-Wei Huang2
1Department of Mechanical and Automation Engineering, National Kaohsiung University of Science and Technology, 2 Jhuoyue Rd., Nanzih, Kaohsiung 811, Taiwan. rkuo@nkfust.edu.tw.
This study introduces a novel 3D packaging technology for flexible wireless biomedical devices. It enables implantable microsystems by vertically integrating chips and coils using parylene and laser-micromachined gold inductors.
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