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Aluminum Patterned Electroplating from AlCl₃⁻[EMIm]Cl Ionic Liquid towards Microsystems Application
Muhammad Salman Al Farisi1, Silvia Hertel2, Maik Wiemer3
1Department of Robotics, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan. salman@mems.mech.tohoku.ac.jp.
Micromachines
|November 15, 2018
Summary
This study investigates patterned aluminum (Al) electroplating from ionic liquid for microsystems. A recurrent galvanic pulse plating process enhances current efficiency for Al film deposition on wafers.
Area of Science:
- Materials Science and Engineering
- Electrochemistry
- Microsystems Engineering
Background:
- Electroplating is crucial for depositing metallic films in microsystems, including wafer-level bonding and thermal actuators.
- Aluminum (Al) electroplating from ionic liquids offers potential for anti-corrosion coatings and advanced microsystems applications.
Purpose of the Study:
- To investigate microstructure formation via patterned Al electroplating from AlCl3–1-ethyl-3-methylimidazolium chloride ((EMIm)Cl) ionic liquid.
- To evaluate the influence of deposition parameters on the Al electroplating process and resulting surface morphology.
- To demonstrate Al electroplating on a patterned wafer for microsystems integration.
Main Methods:
- Patterned electroplating of Al using AlCl3–(EMIm)Cl ionic liquid.
- Evaluation of deposition parameters and their effect on surface morphology.
- Study of Al deposition on both gold (Au) and Al seed layers.
- Utilized a recurrent galvanic pulse plating process.
Main Results:
- Investigated microstructure formation and surface morphology of electroplated Al films.
- Demonstrated successful Al electroplating on both Au and Al seed layers.
- Identified that a recurrent galvanic pulse plating process significantly improves current efficiency.
Conclusions:
- Patterned Al electroplating from ionic liquid is a viable method for microsystems applications.
- Recurrent galvanic pulse plating enhances efficiency for Al film deposition.
- Successful demonstration of Al electroplating on a 2 µm-trenched wafer showcases potential for integrated microsystems.
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