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Related Concept Videos

Density00:56

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Density is an important characteristic of substances, crucial in determining whether an object sinks or floats in a fluid. Its SI unit is kg/m3, and its cgs unit is g/cm3. The density of an object helps in identifying its composition, and also reveals information about the phase of the matter and its substructure. The densities of liquids and solids are roughly comparable, consistent with the fact that their atoms are in close contact. However, gases have much lower densities than liquids and...
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Related Experiment Video

Updated: Feb 2, 2026

Fabrication of High Contact-Density, Flat-Interface Nerve Electrodes for Recording and Stimulation Applications
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Low temperature approach for high density electrical feedthroughs for neural implants using maskless fabrication

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    This study presents a new method for creating high-density electrical feedthroughs for neural implants using gold stud-bumps on aluminum oxide. This technology ensures reliable sealing for over 50 years, crucial for miniaturized medical devices.

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    Area of Science:

    • Materials Science
    • Biomedical Engineering
    • Electrical Engineering

    Background:

    • Implantable electronic packages require reliable electrical feedthroughs for neural implants.
    • Miniaturization of implants demands higher integration densities for these feedthroughs.
    • Existing technologies face challenges in meeting these evolving demands.

    Purpose of the Study:

    • To investigate a novel technology for sealing vertical feedthroughs in aluminum-oxide substrates using gold stud-bumps.
    • To assess the integration density and long-term reliability of these feedthroughs for miniaturized implantable packages.

    Main Methods:

    • Utilized aluminum-oxide substrates with gold stud-bumps for vertical feedthrough sealing.
    • Investigated sealing technology compatible with temperatures below 420°C.
    • Evaluated water leak rates for long-term implantation durations.

    Main Results:

    • Achieved integration densities of up to 1600 feedthroughs/cm².
    • Demonstrated suitable water leak rates for package lifetimes exceeding 50 years for miniaturized packages (>50 feedthroughs, <2 cm³ volume).
    • Manufacturing process is suitable for maskless rapid prototyping.

    Conclusions:

    • The gold stud-bump sealing technology offers a viable solution for high-density electrical feedthroughs in neural implants.
    • This method supports miniaturization and long-term reliability requirements for advanced medical devices.
    • The low-temperature, maskless process facilitates rapid prototyping and manufacturing.