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Self-Standing 3D Cathodes for All-Solid-State Thin Film Lithium Batteries with Improved Interface Kinetics.

Qiuying Xia1,2, Shuo Sun1,2, Jing Xu1,2

  • 1School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing, 210094, China.

Small (Weinheim an Der Bergstrasse, Germany)
|November 24, 2018
PubMed
Summary

Researchers developed advanced 3D thin film batteries (TFBs) using lithium manganese oxide (LMO) nanowall arrays. These 3D TFBs show improved capacity, rate capability, and stability for microelectronics power solutions.

Keywords:
3D thin film batteriesLiMn2O4all-solid-state Li batterieselectrode/electrolyte interfacenanowalls arrays

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Area of Science:

  • Materials Science
  • Electrochemistry
  • Energy Storage

Background:

  • 3D all-solid-state thin film batteries (TFBs) offer potential for microelectronics power.
  • Fabricating self-supported 3D cathodes remains a significant challenge for TFB development.

Purpose of the Study:

  • To develop a novel 3D cathode architecture for enhanced TFB performance.
  • To compare the electrochemical properties of 3D TFBs with conventional 2D TFBs.

Main Methods:

  • Direct deposition of 3D lithium manganese oxide (LMO) nanowall arrays on conductive substrates via magnetron sputtering.
  • Fabrication of 3D and 2D TFBs using LiMn2O4 (LMO) cathodes, lithium phosphorous oxynitride (LiPON) electrolyte, and lithium anode.

Main Results:

  • The 3D TFB demonstrated superior specific capacity (121 mAh g⁻¹ at 1 C) and rate capability (83 mAh g⁻¹ at 20 C) compared to the 2D TFB.
  • The 3D TFB exhibited excellent cycle performance with over 90% capacity retention after 500 cycles.
  • The 3D architecture increased cathode/electrolyte interface, shortened Li⁺ diffusion, and enhanced structural stability, reducing interface resistance.

Conclusions:

  • The 3D nanowall array architecture significantly improves TFB electrochemical performance.
  • This approach mitigates disordered LMO formation, leading to enhanced rate capability and reduced interface resistance.
  • 3D TFBs represent a promising power solution for advanced microelectronic applications.