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Updated: Feb 2, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding

Published on: January 9, 2014

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Ge photodetector monolithically integrated with amorphous Si waveguide on wafer-bonded Ge-on-insulator substrate

Jian Kang, Shinichi Takagi, Mitsuru Takenaka

    Optics Express
    |November 25, 2018
    PubMed

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