Ultrahigh Evaporative Heat Fluxes in Nanoconfined Geometries

Advancement in high-performance photonics/electronics devices has boosted generated thermal energy, making thermal management a bottleneck for accelerated innovation in these disciplines. Although various methods have been used to tackle the thermal management problem, evaporation with nanometer fluid thickness is one of the most promising approaches for future technological demands. Here, we studied thin-film evaporation in nanochannels under absolute negative pressure in both transient and steady-state conditions. We demonstrated that thin-film evaporation in nanochannels can be a bubble-free process even at temperatures higher than boiling temperature, providing high reliability in thermal management systems. To achieve this bubble-free characteristic, the dimension of nanochannels should be smaller than the critical nucleolus dimension. In transient evaporative conditions, there is a plateau in the velocity of liquid in the nanochannels, which limits the evaporative heat flux. This limit is imposed by liquid viscous dissipation in the moving evaporative meniscus. In contrast, in steady-state condition, unprecedented average interfacial heat flux of 11 ± 2 kW cm^-2 is achieved in the nanochannels, which corresponds to liquid velocity of 0.204 m s^-1. This ultrahigh heat flux is demonstrated for a long period of time. The vapor outward transport from the interface is both advective and diffusion controlled. The momentum transport of liquid to the interface is the limiting physics of evaporation at steady state. The developed concept and platform provide a rational route to design thermal management technologies for high-performance electronic systems.