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Related Concept Videos

Types of Chemical Bonds02:37

Types of Chemical Bonds

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Chemical bonding theories were pioneered by American chemist Gilbert N. Lewis. He developed a model called the Lewis model to explain the type and formation of different bonds. Chemical bonding is central to chemistry; it explains how atoms or ions bond together to form molecules. It explains why some bonds are strong and others are weak, or why one carbon bonds with two oxygens and not three; why water is H2O and not H4O. 
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Particles in a solid are tightly packed together (fixed shape) and often arranged in a regular pattern; in a liquid, they are close together with no regular arrangement (no fixed shape); in a gas, they are far apart with no regular arrangement (no fixed shape). Particles in a solid vibrate about fixed positions (cannot flow) and do not generally move in relation to one another; in a liquid, they move past each other (can flow) but remain in essentially constant contact; in a gas, they move...
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Most solids and liquids are incompressible—their densities remain constant throughout. In the presence of an external force, the molecules tend to restore to their original positions, which is only possible because the constituents interact. The interactions help the constituents pass on information about external disturbances, like sound waves. Therefore, sound waves travel faster through these media. Compared to solids, the constituents in a liquid are less tightly bound. Thus, sound...
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Metallic Solids

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Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
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Network covalent solids contain a three-dimensional network of covalently bonded atoms as found in the crystal structures of nonmetals like diamond, graphite, silicon, and some covalent compounds, such as silicon dioxide (sand) and silicon carbide (carborundum, the abrasive on sandpaper). Many minerals have networks of covalent bonds.
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From Molecules to Materials: Engineering New Ionic Liquid Crystals Through Halogen Bonding
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Solid-Liquid Interdiffusion (SLID) Bonding of p-Type Skutterudite Thermoelectric Material Using Al-Ni Interlayers.

Katarzyna Placha1,2, Richard S Tuley3, Milena Salvo4

  • 1European Thermodynamics Ltd., 8 Priory Business Park, Leicester LE8 0RX, UK. katarzyna@etdyn.com.

Materials (Basel, Switzerland)
|December 20, 2018
PubMed
Summary

Researchers developed a new bonding method for thermoelectric materials using aluminum-nickel layers. This technique improves high-temperature stability and reliability for power generation modules.

Keywords:
high-temperature thermoelectric materialjoiningskutteruditesolid-liquid interdiffusion (SLID) bondingtransient-liquid phase bonding (TLPB)

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Area of Science:

  • Materials Science
  • Solid-State Physics
  • Energy Engineering

Background:

  • Thermoelectric power generation offers sustainable energy solutions.
  • Module reliability and high-temperature stability are critical challenges for widespread adoption.
  • Current bonding methods often fall short under operational stress.

Purpose of the Study:

  • To address the bottleneck of thermoelectric module reliability.
  • To demonstrate a novel bonding technique for thermoelectric materials.
  • To investigate the formation and stability of intermetallic compounds during bonding.

Main Methods:

  • Utilized the Solid-Liquid Interdiffusion (SLID) technique.
  • Employed a novel aluminum-nickel multi-layered system for bonding.
  • Investigated various manufacturing parameters and their impact on bonded components.
  • Performed isothermal annealing at operational temperatures to assess stability.

Main Results:

  • Successfully bonded Mmy(Fe,Co)₄Sb12 p-type thermoelectric material to metallic interconnects.
  • Formation of Al₃Ni and Al₃Ni₂ intermetallic compounds (IMCs) with high melting points.
  • Quantified electrical contact resistances and shear strengths for different aluminum transformation states.
  • Observed microstructural evolution and assessed contact stability under simulated working conditions.

Conclusions:

  • The developed aluminum-nickel bonding system enhances the reliability of thermoelectric modules.
  • The diffusion-controlled process creates stable intermetallic compounds suitable for high-temperature applications.
  • This method provides a pathway for cost-effective and durable thermoelectric power generation.