Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface

Area of Science:

• Materials Science
• Surface Chemistry
• Nanotechnology

Background:

• Solid-state organic-inorganic hybridization is crucial for Internet of Things (IoT) integration.
• Conventional bonding methods like vacuum or high temperatures present process and material challenges.

Purpose of the Study:

• To develop an ambient, easy-to-tune method for solid-state organic-inorganic hybrid bonding.
• To create robust interfaces for electronic packaging applications.

Main Methods:

• Utilized vacuum-ultraviolet (VUV) irradiation with ethanol to functionalize aluminum and polyimide surfaces.
• Generated hydroxyl-carrying alkyl chains on both materials.
• Triggered dehydration via heating at 150°C to form inorganic-organic reticulated complexes.

Main Results:

• Achieved robust organic-inorganic bonding at the aluminum/polyimide interface.
• The bonded interface exhibited superior fracture energy ((2.40 ± 0.36) × 10³ J/m²) compared to individual materials.
• Demonstrated excellent interfacial adhesion stability after humidity testing due to anti-hydrolytic carboxylates.

Conclusions:

• The ethanol-assisted VUV (E-VUV) process is a pioneering method for solid-state organic-inorganic bonding.
• This technique offers a versatile approach applicable to various plastics and metals with native oxides.
• The developed bonding strategy overcomes limitations of traditional high-temperature and vacuum-dependent methods.