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Updated: Jan 30, 2026

Planar and Three-Dimensional Printing of Conductive Inks
Published on: December 9, 2011
Chao Xu1, Bronagh Quinn1, Louis Laberge Lebel1
1Mechanical Engineering , Polytechnique Montreal , C.P. 6079, succ. Centre-Ville , Montreal , Québec H3C 3A7 , Canada.
Multi-material direct ink writing (DIW) enables complex 3D steel structures using removable supports. Copper infiltration enhances conductivity and stiffness, while alumina supports prevent contamination.
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