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    This study introduces a novel dual-directional shearography system for precise 2D surface strain analysis. The innovative design enhances light efficiency and system robustness for advanced material characterization.

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    Area of Science:

    • Optics and Photonics
    • Materials Science and Engineering
    • Mechanical Engineering

    Background:

    • Surface strain characterization is crucial for understanding material behavior under stress.
    • Traditional shearography methods often face limitations in two-dimensional strain analysis.
    • Improving light efficiency and system robustness are key challenges in optical metrology.

    Purpose of the Study:

    • To develop and demonstrate a dual-directional shearography system for comprehensive 2D surface strain measurement.
    • To enhance light efficiency and robustness compared to existing shearography techniques.
    • To analyze the influence of optical element positioning on spatial carrier generation.

    Main Methods:

    • A common-path configuration with an additional light path was employed to achieve shearing in two orthogonal directions.
    • A single-aperture-lens Wollaston prism configuration was utilized to introduce distinct spatial carriers for each shearogram.
    • The effect of varying the distance between the aperture and imaging lens on the spatial carrier was investigated.

    Main Results:

    • The developed system successfully generates dual-directional shearograms with improved light efficiency and robustness.
    • Separate control over shearing amount and spatial carrier frequency was achieved by adjusting the aperture-lens distance.
    • Two configurations, simultaneous dual lateral shearography and simultaneous lateral and radial shearography, were demonstrated.

    Conclusions:

    • The dual-directional shearography system offers a flexible and efficient approach for 2D surface strain characterization.
    • Optimizing the placement of optical components, such as the Wollaston prism and aperture, is recommended for future applications.
    • This technology holds potential for advanced non-destructive testing and material analysis.