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Updated: Jan 30, 2026

Soft Lithographic Functionalization and Patterning Oxide-free Silicon and Germanium
Published on: December 16, 2011
We developed a new, cost-effective method to correct distortion in thin silicon substrates caused by thin film coating stress. This technique uses a micro-patterned silicon oxide layer to precisely control stress compensation, significantly reducing surface errors in optical and semiconductor applications.
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