Spring Based Connection of External Wires to a Thin Film Temperature Sensor Integrated Inside a Solid Oxide Fuel Cell

Area of Science:

• Materials Science
• Energy Conversion
• Sensor Technology

Background:

• Effective thermal management is crucial for solid oxide fuel cells (SOFCs) to prevent performance degradation and extend operational lifespan.
• Thin film sensors offer high temporal and spatial resolution for temperature measurement but face integration challenges in SOFC systems due to harsh conditions and sensitivity to interference.
• External wire attachments for sensors can disrupt SOFC operation, requiring careful packaging solutions.

Purpose of the Study:

• To develop and demonstrate a new packaging concept for thin film temperature sensors for SOFC applications.
• To enable reliable integration of thin film sensors into SOFC systems by addressing challenges with external wire attachments.
• To accurately measure SOFC cathode surface temperature under various operating conditions.

Main Methods:

• A novel packaging method for external wire attachments to thin film sensors was designed and implemented.
• Spring-based wire connections were utilized for direct sensor attachment to the SOFC cathode surface.
• Temperature measurements were conducted from room temperature to SOFC operating temperatures under open-circuit voltage (OCV) and operational conditions.
• The influence of contact resistance (Rc) and conductive paste on temperature measurements was analyzed.

Main Results:

• The proposed packaging concept successfully enabled the integration of thin film sensors into the SOFC system.
• Accurate temperature measurements were achieved directly from the SOFC cathode surface.
• High temporal and spatial resolutions were obtained for temperature monitoring.
• The impact of contact resistance on monitored temperature was analyzed, with conductive paste contributing to improved measurements.

Conclusions:

• The developed sensor packaging provides a viable solution for in-situ temperature monitoring in SOFCs.
• This technology facilitates improved thermal management, potentially leading to enhanced SOFC performance and durability.
• The method overcomes key challenges associated with integrating sensitive sensor technologies into demanding SOFC environments.