Hypochlorous-Acid-Generating Electrochemical Scaffold for Treatment of Wound Biofilms
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Updated: Jan 28, 2026

Author Spotlight: Studying Host-Microbe Interactions in Wound Biofilm Formation
Published on: June 16, 2023
Mia Mae Kiamco1, Hannah M Zmuda1, Abdelrhman Mohamed1
1The Gene and Voiland School of Chemical Engineering and Bioengineering, Washington State University, Pullman, WA, USA.
Abstract:
Biofilm formation causes prolonged wound infections due to the dense biofilm structure, differential gene regulation to combat stress, and production of extracellular polymeric substances. Acinetobacter baumannii, Staphylococcus aureus, and Pseudomonas aeruginosa are three difficult-to-treat biofilm-forming bacteria frequently found in wound infections. This work describes a novel wound dressing in the form of an electrochemical scaffold (e-scaffold) that generates controlled, low concentrations of hypochlorous acid (HOCl) suitable for killing biofilm communities without substantially damaging host tissue. Production of HOCl near the e-scaffold surface was verified by measuring its concentration using needle-type microelectrodes. E-scaffolds producing 17, 10 and 7 mM HOCl completely eradicated S. aureus, A. baumannii, and P. aeruginosa biofilms after 3 hours, 2 hours, and 1 hour, respectively. Cytotoxicity and histopathological assessment showed no discernible harm to host tissues when e-scaffolds were applied to explant biofilms. The described strategy may provide a novel antibiotic-free strategy for treating persistent biofilm-associated infections, such as wound infections.
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