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Published on: August 29, 2017
An ultra-flexible modular high vacuum setup for thin film deposition
Thomas Götsch1, Eva-Maria Wernig1, Bernhard Klötzer1
1Department of Physical Chemistry, University of Innsbruck, Innrain 52c, A-6020 Innsbruck, Austria.
This study presents a modular high vacuum chamber for flexible thin film deposition. Its tool-free assembly and adaptable design enable rapid changes between evaporation and sputtering techniques for multilayer systems.
Area of Science:
- Materials Science
- Vacuum Technology
- Thin Film Deposition
Background:
- Developing versatile thin film deposition systems is crucial for advanced materials research.
- Existing setups often lack flexibility, limiting the ability to explore diverse deposition techniques and multilayer structures.
Purpose of the Study:
- To present a modular high vacuum chamber designed for high flexibility in thin film deposition.
- To detail the infrastructure for simultaneous operation of multiple deposition techniques.
- To demonstrate the chamber's capability for creating unsupported multilayer thin films.
Main Methods:
- Utilized a modular high vacuum chamber with O-ring-sealed flat flanges for tool-free assembly.
- Integrated thermal evaporation, electron beam evaporation, and magnetron sputtering techniques.
- Employed baking procedures to remove residual water and ensure high vacuum conditions.
- Developed stainless steel/aluminum interconnectors for incorporating additional equipment.
Main Results:
- Achieved rapid adaptation of the chamber for different deposition sources within minutes.
- Successfully prepared unsupported thin film systems, including platinum nanoparticles in zirconia.
- Demonstrated consecutive depositions for multilayer system formation on a single substrate.
- Analyzed film properties using transmission electron microscopy, X-ray photoelectron spectroscopy, and atomic force microscopy.
Conclusions:
- The presented modular vacuum chamber offers high flexibility for diverse thin film deposition techniques.
- The tool-free assembly and adaptable design facilitate rapid setup changes for multilayer fabrication.
- The system enables the creation and analysis of novel unsupported thin film materials.
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