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Updated: Jan 27, 2026

Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station
Published on: April 1, 2020
Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components
Sylwester Bargiel1, Maciej Baranski2, Maik Wiemer3
1Département MN2S, FEMTO-ST (UMR CNRS 6714), University of Bourgogne Franche-Comté (UBFC), 15B Avenue des Montboucons, 25030 Besançon, CEDEX, France. sylwester.bargiel@femto-st.fr.
Abstract:
We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.
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