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Related Concept Videos

Polymers02:34

Polymers

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The word polymer is derived from the Greek words “poly” which means “many” and “mer” which means “parts”. Polymers are long chains of molecules composed of repeating units of smaller molecules, known as monomers. They either occur naturally, such as DNA and proteins, or can be constructed synthetically, like plastics. They have varied structural characteristics, such as linear chains, branched chains, or complex networks, that contribute to the...
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Polymers02:34

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Bonding in Metals02:32

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Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”. 
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Metallic Solids02:37

Metallic Solids

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Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....
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Alkali Metals03:06

Alkali Metals

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Group 1 elements are soft and shiny metallic solids. They are malleable, ductile, and good conductors of heat and electricity. The melting points of the alkali metals are unusually low for metals and decrease going down the group, while the density increases going down the group with the exception of potassium (Table 1).
Table 1: Properties of the alkali metals
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Metal-Ligand Bonds02:51

Metal-Ligand Bonds

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The hemoglobin in the blood, the chlorophyll in green plants, vitamin B-12, and the catalyst used in the manufacture of polyethylene all contain coordination compounds. Ions of the metals, especially the transition metals, are likely to form complexes.
In these complexes, transition metals form coordinate covalent bonds, a kind of Lewis acid-base interaction in which both of the electrons in the bond are contributed by a donor (Lewis base) to an electron acceptor (Lewis acid). The Lewis acid in...
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Related Experiment Video

Updated: Jan 27, 2026

Reactive Vapor Deposition of Conjugated Polymer Films on Arbitrary Substrates
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Reactive Vapor Deposition of Conjugated Polymer Films on Arbitrary Substrates

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Laser-Induced Selective Metallization on Polymer Substrates Using Organocopper for Portable Electronics.

Jihai Zhang1,2, Jin Feng1, Liyang Jia1

  • 1State Key Laboratory of Polymer Materials Engineering of China, Polymer Research Institute , Sichuan University , Chengdu 610065 , China.

ACS Applied Materials & Interfaces
|March 20, 2019
PubMed
Summary

This study introduces a new method for creating precise metal patterns on polymers using laser direct structuring (LDS) with organocopper compounds. This technique enables efficient copper circuit fabrication on acrylonitrile-butadiene-styrene (ABS) for potential industrial applications.

Keywords:
laser activationlaser-inducedorganocopperpolymerselective metallization

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Area of Science:

  • Materials Science
  • Polymer Chemistry
  • Surface Engineering

Background:

  • Laser Direct Structuring (LDS) is a key technology for fabricating conductive patterns on insulating substrates.
  • Developing efficient laser sensitizers for LDS is crucial for enhancing metalization processes.
  • Organometallic compounds offer potential as novel sensitizers due to their unique thermal and photochemical properties.

Purpose of the Study:

  • To develop a facile strategy for selective metalization of polymer substrates using organocopper compounds and LDS technology.
  • To investigate the effectiveness of copper oxalate (CuC2O4) and copper acetylacetonate [Cu(acac)2] as laser sensitizers in an acrylonitrile-butadiene-styrene (ABS) matrix.
  • To demonstrate the fabrication of conductive copper circuits and near-field communication (NFC) components on polymer surfaces.

Main Methods:

  • Preparation of ABS composites incorporating copper oxalate and copper acetylacetonate.
  • Laser direct structuring using a 1064 nm pulsed near-infrared laser for material activation.
  • Electroless copper plating (ECP) on laser-activated sites to form conductive patterns.
  • Characterization using X-ray photoelectron spectroscopy (XPS) and conductivity measurements.

Main Results:

  • Copper oxalate and copper acetylacetonate effectively generated Cu0 nanoparticles upon laser irradiation, acting as catalysts for ECP.
  • XPS analysis confirmed significant reduction of Cu2+ to Cu0 (58.3% for CuC2O4, 63.9% for Cu(acac)2).
  • Achieved high conductivities for copper circuits: 1.22 × 10^7 Ω^-1·m^-1 (ABS/CuC2O4) and 1.58 × 10^7 Ω^-1·m^-1 (ABS/Cu(acac)2) after 30 min ECP.
  • Successfully demonstrated patterned conductive circuits and NFC components.

Conclusions:

  • Organocopper compounds, specifically copper oxalate and copper acetylacetonate, are effective laser sensitizers for LDS on ABS substrates.
  • The proposed method provides a facile and selective route for fabricating precise metalized patterns on polymers.
  • This technology holds significant potential for industrial applications in electronics and integrated circuitry.