Mechanically Enhanced Electrical Conductivity of Polydimethylsiloxane-Based Composites by a Hot Embossing Process

Area of Science:

• Materials Science
• Polymer Science
• Nanotechnology

Background:

• Conductive polymer composites face limitations due to brittleness and moderate conductivity.
• Applications in modern technologies are constrained by these material properties.

Purpose of the Study:

• To develop super high electrical conductive and mechanically flexible polymer composites.
• To overcome the limitations of existing conductive polymer materials.

Main Methods:

• Utilized a novel hot embossing design for polydimethylsiloxane (PDMS) composites with short carbon fiber (SCF).
• Investigated the effect of sample thickness reduction and compression on electrical properties.
• Incorporated secondary nanofillers like carbon nanotubes and conducting carbon black.

Main Results:

• Achieved an electrical percolation threshold at 0.45 wt % SCF in PDMS composites.
• Hot embossing enhanced conductivity to 378 S/m at 8 wt % SCF by reducing thickness to 0.1 mm.
• Addition of nanofillers further boosted conductivity to 909 S/m (with carbon nanotubes) and 657 S/m (with conducting carbon black).

Conclusions:

• A synergistic approach combining mechanical compression and hierarchical micro-/nano-scale fillers yields super high conductive, flexible polymer composites.
• The developed materials are suitable for modern flexible electronics applications.
• This method offers a pathway to overcome previous constraints in conductive polymer composite performance.