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Area of Science:

  • Photonics and Optical Engineering
  • Integrated Circuit Technology
  • Telecommunications

Background:

  • Integrated circuit technologies are advancing optical packet switch matrices.
  • Indium phosphide (InP) integrated photonics provides high-performance components like amplifiers, switches, and detectors on a single wafer.
  • Maturing process technologies allow for increased component density, enabling complex circuits.

Purpose of the Study:

  • To review the current state of InP integrated photonics for optical switch matrices.
  • To highlight the feasibility of additional on-chip functions with active component integration.
  • To explore opportunities for introducing physical layer intelligence and scalable switching solutions.

Main Methods:

  • Review of current research and development in InP integrated photonics for optical switching.
  • Analysis of active-passive monolithic integration capabilities for switch matrix construction.
  • Examination of laboratory demonstrations for multi-path and packet time-scale switching.

Main Results:

  • Development of InP switching matrices with up to 480 components, supporting 16x16 connections.
  • Demonstration of integrated switching matrices capable of routing data streams at hundreds of gigabits per second.
  • Realization of wavelength-granularity routing and on-chip monitoring.

Conclusions:

  • InP integrated photonics is a key enabler for intelligent, cost-effective, and energy-efficient optical packet switches.
  • Active component integration opens new possibilities for advanced functionalities within optical switch matrices.
  • Further development is needed to meet the requirements for scalable and intelligent physical layer switching.