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Updated: Jan 25, 2026

Micropatterning and Assembly of 3D Microvessels
Published on: September 9, 2016
Three-dimensional micropatterning of semiconducting polymers via capillary force-assisted evaporative self-assembly
Jae In Shin1, Su Jung Cho, Jisoo Jeon
1Department of Polymer Science and Engineering, Inha University, Incheon 22212, South Korea. wie@inha.ac.kr.
Abstract:
Controlled evaporative self-assembly of semiconducting polymers has mostly been studied on 2-dimensional flat substrates. In this study, we reported capillary-assisted evaporative self-assembly of poly(3-hexylthiophene 2,5-diyl) (P3HT) into 3-D micro-ring patterns through the stick-slip phenomenon within a 3-dimensional cylinder. We deconvoluted the well-known two-step stick-slip phenomenon into three regimes through in situ monitoring of the P3HT self-assembly process using a high-speed camera: pinning and deposition; depinning and slip; and retraction regimes. Furthermore, we investigated the effects of various parameters associated with the self-assembly, including polymer concentration, tilt angle, magnetic field, and evaporation temperature, thus achieving self-assembled microarchitectures with diverse dimensions ranging from dots to lines and networks. The self-assembled microstructures were analyzed qualitatively and quantitatively by evaluating the fast Fourier transform image, surface coverage, fractal dimension and lacunarity of the micropatterns.
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