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Related Experiment Video

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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
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Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer Bonding.

Boyan Huang1, Chenxi Wang2, Hui Fang3

  • 1School of Instrumentation Science and Engineering, Harbin Institute of Technology, Harbin 150001, China. byhuang@hit.edu.cn.

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|May 25, 2019
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Summary

A novel moiré-based alignment method enhances wafer bonding precision for heterogeneous integration. This technique achieves sub-300 nm alignment accuracy, crucial for advanced semiconductor manufacturing and opaque wafer applications.

Keywords:
alignment accuracyalignment markcentrosymmetric gratingmeasurement rangemoiré fringewafer bonding

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Area of Science:

  • Semiconductor Manufacturing
  • Materials Science
  • Nanotechnology

Background:

  • High-precision wafer bonding is critical for heterogeneous integration as device dimensions shrink.
  • Existing alignment methods often require complex conventional marks and may struggle with opaque materials.

Purpose of the Study:

  • To introduce a moiré-based alignment method for more accurate and convenient wafer bonding.
  • To enable both coarse and fine alignment without traditional alignment marks.
  • To address challenges in backside alignment for opaque wafers.

Main Methods:

  • Utilizing centrosymmetric grating marks for moiré pattern generation.
  • Implementing a moiré-based alignment strategy within an aligned wafer bonding system.
  • Developing a working principle for backside alignment using the moiré technique.

Main Results:

  • Achieved alignment accuracy better than 300 nm (3σ) after bonding.
  • Demonstrated a method that eliminates the need for conventional cross-and-box alignment marks.
  • Successfully proposed a backside alignment principle for opaque wafer bonding.

Conclusions:

  • The moiré-based alignment method offers superior precision for wafer bonding.
  • This technique is suitable for demanding wafer-level stacking technologies.
  • The proposed backside alignment principle overcomes limitations with opaque materials.