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Analytical Prediction of Subsurface Damages and Surface Quality in Vibration-Assisted Polishing Process of Silicon
Yan Gu1, Yan Zhou2, Jieqiong Lin3
1Key Laboratory of Micro/Nano and Ultra-precision Manufacturing, School of Mechatronic Engineering; Changchun University of Technology, Changchun 130012, China. guyan@ccut.edu.cn.
Abstract:
Subsurface damages and surface roughness are two significant parameters which determine the performance of silicon carbide (SiC) ceramics. Subsurface damages (SSD) induced by conventional polishing could seriously affect the service life of the workpiece. To address this problem, vibration-assisted polishing (VAP) was developed to machine hard and brittle materials, because the vibration-assisted machine (VAM) can increase the critical cutting depth to improve the surface integrity of materials. In this paper, a two-dimensional (2D) VAM system is used to polish SiC ceramics. Moreover, a theoretical SSD model is constructed to predict the SSD. Furthermore, finite element simulation (FEM) is adopted to analyze the effects of different VAP parameters on SSD. Finally, a series of scratches and VAP experiments are conducted on the independent precision polishing machine to investigate the effects of polishing parameters on brittle-ductile transition and SSD.
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